微见智能高精度固晶机首次亮相新加坡光博会
3月6日~8日，2024亚洲光电博览会如期举办，微见智能携全系列产品亮相，展位号DA-01，欢迎业界朋友莅临展位观展交流。
Microview Intelligent Packaging Technology (Shenzhen) Co., ltd Sincerely invite you to participate to be held on Marina Bay Beach, Singapore from March 6th to 8th, 2024，APE2024 Asian Photography Expo.Booth No.：DA-01.
亚洲光电博览会作为一个国际领先的光电综合性品牌推广及商贸洽谈平台，聚焦亚洲光电行业最新前沿创新科技及新兴应用市场，促进光电行业上下游的深度交流及商业合作。
Asia Photonics Expo (APE) is a world’s leading holistic photonics platform for branding and business connection, focusing on the latest cuttingedge innovative technologies and the emerging application markets in Asia, aiming to promote the in-depth communication and business collaboration between the photonics upstream and downstream professionals.
产品展示：
Glance at the Products:
多功能全自动高精度固晶机MV-15D
贴装工艺：共晶，环氧胶/银胶/UV胶固晶工艺
产品应用：COC/COS; AOC/COB; GOLD BOX; RF/Hybrid Device
贴装精度：±1.5um (标准片)；±3um (芯片贴装)
应用领域：光通信、激光雷达、射频、微波、红外、商业激光器、军工、航空航天
产品优势：
工艺能力强大：单机同时具备共晶、蘸胶、点胶、UV等工艺能力
多种上下料方式：支持蓝膜、Gel pack/waffle pack、轨道等上下料方式，支持Wafer Map
多芯片应用：单机支持上100种不同类型吸嘴全自动更换；8吸嘴全自动快速切换绑头模组可选
多语言软件界面：支持中英文软件界面。支持操作软件界面特定语言定制；
高柔性软件：功能强大、可编程、灵活的应用软件系统，支持不同产品应用，支持多种工艺应用自由切换；
高效率物料转运：全自动上下料系统，流水线物料转运系统；支持自动化产线，左进右出连接产线。
MV-15D High-accuracy Die Bonder （Multi function，Flexible）
Process:Eutectic;Epoxy glue/Silver glue/UV epoxy bonding
Application:COC/COS; AOC/COB; GOLD BOX
Precision:±1.5um(Standard glass die)
Cycle time:5S(one pick&place for standard glass die);excluding temperature profile
① High Accuracy: Glass die ±1.5um
② Multi-Function：Supports for different process including Eutectic, Stamping, Dispensing, UV curing etc.
③ Multi-chips application: Supports for up to 100 different types of suction nozzles with fully automatic replacement
④ High flexibility software: Supports different product applications and allows for free switching of multiple process applications.
高速高精度共晶机MV-15H-S
贴装工艺：共晶
产品应用：COC/COS
贴装精度：±1.5um（标准片）；±3um (芯片贴装)
应用领域：大功率激光器、光通信、激光雷达、5G 射频、商业激光器
产品优势：
共晶质量优秀：
历经国内多个行业标杆客户三年量产验证，共晶焊接质量比肩全球大厂；
广泛应用在:大功率激光器、光通信、军工、射频、微波、红外、激光雷达等行业;
效率领先全球：
独有3绑头设计：贴装系统微见倚天剑高精度绑头系统，芯片上料微见屠龙刀高精度绑头系统，基板转移微见屠龙刀高精度绑头系统；
6个发明专利支撑；
UPH可达180（共晶15秒+非工艺时间5秒）；
工艺能力强大：
具有COC单管共晶、Bar条共晶、COC入管壳共晶工艺能力；支持摩擦共晶焊等复杂工艺;可支持客户全自动化产线建设需求。
MV-15H-S High-accuracy Die Bonder（High Speed，Eutectic process）
Process:Eutectic;Eutectic
Application:COC/COS
Precision:±1.5um(Standard glass die)
Cycle time:5s(Standard glass die pick&place);excluding temperature profile
① High Accuracy: Glass die ±1.5um
② High reliable Eutectic Process: Specific for COC/COS eutectic application, Validated by industry benchmark customers in China, Proved high Eutectic quality for long term mass production.
③ High production efficiency: unique 3-head design for Parallel operation; the total cycle time is only one pick/Place time (5s) plus the temperature profile time.
④ Multi-chip application: Multiple suction nozzles for each bondhead with fully automatic replacement, Supports for Multi-chips process，allows for free switching of multiple process applications.
高速高精度共晶机MV-15H-M（支持多芯片同时共晶）
贴装工艺：共晶
产品应用：COC/COS
贴装精度：±1.5um（标准片）；±3um (芯片贴装)
应用领域：光通信、激光雷达、5G 射频、商业激光器
产品优势：
共晶质量优秀：
历经国内多个行业标杆客户三年量产验证，共晶焊接质量比肩全球大厂；
广泛应用在:大功率激光器、光通信、军工、射频、微波、红外、激光雷达等行业;
高质量多芯片同时共晶：
微见四叉戟高精度绑头系统：1主3副共4个绑头；
多芯片共晶定制设计，同时吸取多个芯片再置于基板；
多个芯片同时共晶，多个芯片近似相等共晶时间；
工艺能力强大：
具有COC单管共晶、Bar条共晶、COC入管壳共晶工艺能力；支持摩擦共晶焊等复杂工艺;可支持客户全自动化产线建设需求。
MV-15H-M High-accuracy Die Bonder（High Speed，Eutectic process）
Process:Eutectic;Eutectic
Application:COC/COS
Precision:±1.5um(Standard glass die)
Cycle time:5s(Standard glass die pick&place);excluding temperature profile
① High Accuracy: Glass die ±1.5um
② High reliable Eutectic Process: Specific for COC/COS eutectic application, Validated by industry benchmark customers in China, Proved high Eutectic quality for long term mass production.
③ High production efficiency: unique 3-head design for Parallel operation; the total cycle time is only one pick/Place time (5s) plus the temperature profile time.
④ Multi-chip application: Multiple suction nozzles for each bondhead with fully automatic replacement, Supports for Multi-chips process，allows for free switching of multiple process applications.
高速高精度固晶机MV-15T
贴装工艺：环氧胶/银胶/UV胶固晶工艺
产品应用：COB/AOC; GOLD BOX...
贴装精度：±1.5um（标准片）；±3um (芯片贴装)
应用领域：光通信、激光雷达、军工、航天等
产品优势：
高精度协同：3个高精度绑头协同工作，左绑头负责点胶/蘸胶，右绑头负责芯片蓝膜华夫盒上料，主绑头负责贴片，芯片贴装精度高于±3um；
高速度贴装：5S（单芯片贴装时间，含上料、点胶/蘸胶、贴装全工艺流程），主绑头贴装芯片以外的工艺动作全部并行工作，不影响效率；
高效率物料转运：全自动上下料系统，流水线物料转运系统；支持自动化产线，左进右出连接产线。
多语言软件界面：支持中英文软件界面。支持操作软件界面特定语言定制；
MV-15T High-accuracy Die Bonder (High Speed , Epoxy process)
Process: Silver glue/UV epoxy bonding
Application:COB/AOC; GOLD BOX...
Precision:±1.5um(Standard glass die)
Cycle time:5s(Standard glass die pick&place
① High Accuracy: Glass die ±1.5um
② High Quality Epoxy Process: Specific for COB/Gold Box epoxy application, Supports for Stamping, expensing, UV curing during the bonding process.
③ High production efficiency: unique 3-head design for Parallel operation; the total cycle time is only one pick/Place for 5S.
④ Multi-chip application: Multiple suction nozzles for each bondhead with fully automatic replacement, Supports for Multi-chips process，allows for free switching of multiple process applications.
展位图：
Floorplan:
展位号：DA-01
关于微见智能：
微见智能封装技术（深圳）有限公司成立于2019年12月，是专业从事高精度复杂工艺芯片封装设备研发和生产的高科技企业。
微见核心成员长期服务于欧美国际大厂，具有20多年高精度芯片封装行业经验。微见拥有高精度芯片封装工艺、高精度机械运控平台、机器视觉和算法、高精度工艺模组等全套自主核心技术。
微见智能将致力于打造国际一流的高端芯片封装装备企业，致力与全球企业建立合作伙伴关系！
About Microview：
The Microview Intelligent Packaging Technology (Shenzhen) Co., Ltd，founded in 2019,specializing in the R & D and production of high-precision chip packaging equipment .
Microview has a complete set of independent core technologies,the core members have more than 20 years of experience in high-precision chip packaging industry.
Microview Intelligent is dedicated to building a world-class, high-end chip packaging equipment enterprise and is committed to establishing partnerships with enterprises around the world.
